As part of
this process, Sony today announced that manufacturing operations in Japan for
certain of its product categories will be consolidated in order to increase
their efficiency. Details are as follows:
1) Digital
Imaging manufacturing operations to be consolidated under EMCS Corp. Tokai
TEC.
• All
domestic manufacturing operations related to digital imaging products, including
digital still cameras, video cameras and camera modules, currently conducted at
Sony EMCS Corp. Kohda TEC (located in Kohda, Aichi Prefecture), Sony EMCS Corp.
Minokamo TEC (located in Minokamo, Gifu Prefecture) and Sony EMCS Corp. Omigawa
TEC (Katori, Chiba Prefecture) will be consolidated under the management of Sony
EMCS Corp. Tokai TEC to be established on July 1, 2009 in Kohda, Aichi
Prefecture. Tokai TEC will be created through the integration of
organizations of Kohda TEC and Minokamo TEC in order to eliminate duplication
and optimize administrative functions. Tokai TEC will continue
manufacturing operations at current Kohda TEC and Minokamo TEC in a manner
designed to best utilize the manufacturing facilities at the two
sites.
• As
part of this consolidation, Sony’s camera module production, currently based at
Omigawa TEC, will be transferred to Tokai TEC.
2) Optical Pickup
operations to be consolidated at EMCS Corp. Kisarazu TEC.
• The
development of manufacturing technologies and support functions for factories
outside of Japan relating to optical pickups currently conducted at Sony EMCS
Corp. Hamamatsu TEC (Hamamatsu, Shizuoka Prefecture), and the development of
manufacturing technologies and support functions for factories outside Japan
relating to optical pickup lenses located at Sony EMCS Omigawa TEC, will be
transferred to Sony EMCS Corp. Kisarazu TEC (Kisarazu, Chiba Prefecture), which
currently manufactures optical disc-related products such as Blu-ray disc
recorders. By concentrating its expertise in optical disc technology
in one location, Sony hopes to achieve additional technological advancements,
eliminate duplication for greater efficiency, and bolster synergies between
products and components to further enhance the competitiveness of its optical
pickup business.
3) Small and
Mid-size LCD Panel operations to be consolidated under Sony Mobile Display
Corp.
• The
support functions for factories outside Japan currently conducted by Sony EMCS
Corp. Hamamatsu TEC regarding small- and mid-size LCD panel operations will be
transferred to Sony Mobile Display Corp.’s Higashiura Site (Higashiura, Aichi
Prefecture). As a result, all of Sony’s small- and mid-size LCD panel
operations in Japan will be consolidated under the management of Sony Mobile
Display Corp.
4) Mobile
phone-related manufacturing and customer service operations to be consolidated
at Sony EMCS Corp. Tokai TEC, Minokamo Site
• Japan
domestic mobile phone customer service operations contracted to Sony EMCS Corp.
Senmaya TEC (Ichinoseki, Iwate Prefecture) and Sony EMCS Corp. Mizunami
Technology Site (Mizunami, Gifu Prefecture) by Sony Ericsson Mobile
Communications Japan Inc., will be transferred to Sony EMCS Corp. Tokai TEC
Minokamo Site, which currently manufactures mobile phones (also under contract
from Sony Ericsson Mobile Communications Japan Inc.). This measure is
aimed at establishing an integrated operational structure from manufacturing
through to customer service in order to improve both manufacturing efficiency
and customer service quality.
Apart from
the transfer of the mobile phone-related operations to Sony EMCS Corp. Tokai
TEC, the remaining production of electronic devices currently conducted at Sony
EMCS Corp. Senmaya TEC will be transferred to Sony EMCS Corp.’s Kisarazu TEC and
other locations.
As a
result of these moves, production at Sony EMCS Corp. Omigawa, Hamamatsu and
Senmaya TECs is scheduled to cease at the end of December 2009.
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