Company Highlights Industry’s First 245.76 TB SSD and Other Innovations Redefining Storage for AI-Driven Infrastructure

KIOXIA America, Inc., the inventor of NAND flash memory, will once again take center stage at FMS: the Future of Memory and Storage to spotlight how its flash memory and SSD innovations are driving scalable, efficient infrastructure for artificial intelligence (AI). With a focus on real-world applications and performance gains, Kioxia will demonstrate how its latest solutions meet the evolving demands of AI across data center and enterprise environments.

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At FMS, Kioxia will demonstrate how its latest solutions meet the evolving demands of AI across data center and enterprise environments.

At FMS 2025, Kioxia will spotlight its newest products, including the high-capacity KIOXIA LC9 Series - the industry’s first¹ 245.76 terabyte (TB)² NVMe™ SSD. Additional highlights include the KIOXIA CM9 Series and KIOXIA CD9P Series SSDs built with the company’s BiCS FLASH™ generation 8 3D flash memory, delivering performance, power efficiency, and versatility. Kioxia will also display BiCS FLASH™ generation 9 memory, which uses 1 terabit (Tb)³ 3bit/cell technology and utilizes the CBA (CMOS directly Bonded to Array) architecture introduced in the generation 8. BiCS FLASH™ generation 9 memory provides improvements in data read speed and power consumption reduction, PI-LLT and SCA.

“AI is redefining data infrastructure – and Kioxia is transforming storage to match,” said Scott Nelson, Executive Vice President and Chief Marketing Officer for KIOXIA America, Inc. “As a pioneer in flash memory, Kioxia is leading the way with scalable, high-performance solutions purpose-built for AI. Our latest BiCS FLASH™ technology – featuring a 32-die stack QLC architecture and innovative CBA technology – delivers an industry-first¹ 8TB³ per chip package. This milestone sets a new standard for the performance, scale, and efficiency required to support next-generation AI workloads.” At FMS, Kioxia will give a keynote presentation and several educational sessions covering a range of topics:

FMS Keynote Presentation:

“Optimize AI Infrastructure Investments with Flash Memory Technology and Storage Solutions”

Tuesday, August 5 at 11:00 am PDT

Katsuki Matsudera, General Manager of the memory technical marketing managing department for Kioxia Corporation, and Neville Ichhaporia, Senior Vice President and General Manager of the SSD business unit for KIOXIA America, Inc., will present this keynote session.

Executive AI Premier Level Panel:

“Memory and Storage Scaling for AI Inferencing”

Thursday, August 7 at 11:00 am PDT

Rory Bolt, Senior Fellow and Principal Architect, SSD business unit for KIOXIA America Inc., will participate in an executive session, which brings together a panel of experts from inside NVIDIA^® and across the storage and memory industry. The panel provide insight on how to avoid potential pitfalls and configure, secure, and tune to get the most out of storage and memory for different AI applications.

Kioxia’s expertise will also be featured in panel discussions and educational tracks throughout the week.

Educational Speaking Sessions by Kioxia:

Monday, August 4

Professional Development Series Track

1:00-2:45 pm

PDSD1: KIOXIA AiSAQ™ OSS: Scaling RAG Beyond DRAM Limits with SSD

Speaker: Rory Bolt

• Review of KIOXIA AiSAQ

Tuesday, August 5

Automotive Applications Track

8:30-9:35 am

AUTO-101-1: Software Defined Vehicles

Speaker: Kevin Hsu

• How UFS Storage is Evolving for On-Device AI and Autonomous Vehicles

AI and ML Applications Track

9:45-10:50 am

AIML-102-1: Storage for AI: Applications

Speaker: Assaf Sella

• All-in-storage ANNS Algorithms Optimize Performance Within a RAG System

Computational Storage Track

9:45-10:50 am

COMP-102-1: Computational Storage Implementations and Ideas

Speaker: Mahinder Saluja

• Integrate Multiple Offload Fixed Function Storage Services to Storage Subsystem

Wednesday, August 6

SSD Tech Track

8:30–9:35 am

SSDT-201-1: SSD Technologies for AI and the DC

Speaker: Rory Bolt

• High IOPS SSD for AI Applications

Data Security/Ransomware Protection Track

8:30–9:35 am

DSEC-201-1: Data Defense: Advanced Protection Strategies and Compliance

Speaker: Paul Suhler

• Sanitization: Product Requirements and Legal Requirements

Industry Associations Track

8:30–9:35 am

INDA-201-1: NVMe™ State of the Union, Configurable Device Security and QoS

Speaker: Cameron Brett (Chairperson)

• Hosting the session

CXL™ Track

3:20–4:25 pm

CXLT-203-1: CXL Use Cases

Speaker: Mahinder Saluja

• Eliminate Data Bottlenecks with CXL Interface and Low-latency XL-Flash

SSD Technology Track

3:20–4:25 pm

SSDT-203-1: High Cap SSDs and Optimizations for QLC Flash Storage

Speaker: Mike Klemm

• Transformative Advancements in Solid State Drives (SSDs)

FDP and ZNS Track

3:20–4:25 pm

FARC-203-1: Flash Architectures and Provisioning

Speaker: Rory Bolt

• FDP Use Cases

Thursday, August 7

DC Storage and Memory Track

8:30–9:35 am

DCTR-301-1: Enterprise Storage and SSD

Speaker: Mahinder Saluja

• Offloading Storage Compute Tasks from DPU to SSD Can Free Compute Resources

NVMe™ Track

9:45–10:50 am

NVME-302-1: NVMe New Features

Speaker: Cameron Brett (Organizer)

• NVMe protocol innovations and their implications for future architectures

SSD Technology Track

1:25–2:30 pm

SSDT-304-1: Error Correction, Reliability, and Telemetry Techniques for SSDs

Speaker: Devesh Rai

• Data Scrubbing and Rebuild in a High-capacity SSD Environment

QLC and PLC Track

1:25–2:30 pm

QLCP-304-1: Multi-Level Cells Part 2

Speaker: Kevin Hsu

• Enabling Higher Capacity Storage with QLC UFS

Data Security/Ransomware Protection Track

1:25–2:30 pm

DSEC-304-1: Quantum Resilience: The New Storage Security Frontier

Speaker: Paul Suhler

• Get Ready for Post Quantum Cryptography

KIOXIA Booth Demos

Product and technology demonstrations will be given in the iconic 2-level Kioxia booth #307 - featuring ten separate exhibit locations - on the show floor, including:

• Expanding Use Cases - High-Capacity Package/Low Latency Flash memory: 32-die stack in a small BGA package of BiCS FLASH™ generation 8 QLC 3D flash memory /XL-FLASH with a CXL™ interface
• KIOXIA BiCS FLASH™ generation 9 3D Flash Memory: 1 Tb³ wafer and a small BGA package with 512 Gb chip
• KIOXIA BiCS FLASH™ generation 10 3D Flash Memory: 1 Tb³ wafer and model display
• KIOXIA UFS - Consumer and Automotive: High performance solutions for evolving markets
• High Capacity 245.76 TB² SSD in Dell PowerEdge™ 7715: Featuring KIOXIA LC9 Series Enterprise NVMe™ SSDs
• Performance and Power Demo: Featuring KIOXIA CD9P Series Data Center NVMe SSDs
• ML Perf Storage Training: Featuring KIOXIA CM9 Series Enterprise NVMe SSDs
• GPU direct SSD Emulation: Investigating GPU direct storage devices at 143 million IOPS
• KIOXIA AiSAQ™ Software: Enabling flexible balancing of capacity and performance
• RAID Offload and Data Scrubbing: Featuring KIOXIA CM7 Series Enterprise NVMe™ SSDs

For more information, please visit www.kioxia.com, and follow the company on X, formerly known as Twitter and LinkedIn^®.

About KIOXIA America, Inc.

KIOXIA America, Inc. is the U.S.-based subsidiary of Kioxia Corporation, a leading worldwide supplier of flash memory and solid-state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, Kioxia continues to pioneer innovative memory, SSD and software solutions that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, automotive systems, data centers and generative AI systems. For more information, please visit Kioxia.com.

© 2025 KIOXIA America, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Kioxia product specifications.

Notes:

1: As of August 4, 2025. Based on a Kioxia survey.

2: Definition of SSD capacity: Kioxia Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 bytes = 1,073,741,824 bytes and 1TB = 2^40 bytes = 1,099,511,627,776 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary.

3: The flash memory capacity is calculated as 1 terabit (1 Tb) = 1,099,511,627,776 (2^40) bits, and 1 terabyte (1 TB) = 1,099,511,627,776 (2^40) bytes.

Read and write speed may vary depending on various factors such as host devices, software (drivers, OS etc.), and read/write conditions.

NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.

NVIDIA is a registered trademark of NVIDIA Corporation.

CXL is a trademark of Compute Express Link Consortium, Inc.

Dell Technologies, Dell, and other trademarks are trademarks of Dell Inc. or its subsidiaries.

Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification. JEDEC is a registered trademark of JEDEC Solid State Technology Association.

LinkedIn is a trademark of LinkedIn Corporation and its affiliates in the United States and/or other countries.

Other company names, product names and service names may be trademarks of third-party companies.

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“AI is redefining data infrastructure – and Kioxia is transforming storage to match. As a pioneer in flash memory, Kioxia is leading the way with scalable, high-performance solutions purpose-built for AI.”