~ See StratEdge’s packages and gold plated mounting tabs for high-frequency, high-power GaN and GaAs devices

StratEdge Corporation, a leader in the design, production, and assembly of high-frequency, high-power, and high-reliability packages, announces that it will exhibit at three upcoming industry events: CSMantech, May 18–20, Portland, OR, Booth 418; Space Tech Expo USA, June 3–4, Anaheim, CA, Booth 323; and IEEE International MTT Symposia (IMS), June 9–11, Boston, MA, Booth 23060.

StratEdge will showcase its complete line including post-fired ceramic packages, lower-cost molded ceramic packages, and gold plated mounting tabs for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. The post-fired ceramic semiconductor packages operate from DC to 63+ GHz. These packages have electrical transition designs that ensure exceptionally low electrical losses and efficient operation. The company will also be available to discuss molded ceramic package options for RF and microwave applications up to 18 GHz. StratEdge’s molded ceramic packages provide designers with a broad range of high-reliability options for defense, aerospace, and other harsh-environment applications.

StratEdge’s gold plated tabs support eutectic die attachment of GaN and other high-frequency, high-power devices using gold-tin (AuSn) and gold-silicon (AuSi). For chip-on-board applications, the chip is attached to the thermally conductive tab before the tab is installed onto the board. This helps ensure that the critical first-level interface between chip and system is optimized for maximum device performance.

“Engineers working with GaN, GaAs, and other compound semiconductor devices need packaging,” said Tim Going, President of StratEdge. “CSMantech, Space Tech Expo, and IMS all give us the opportunity to meet directly with customers designing advanced devices for RF, microwave, space, defense, and other demanding applications.”

Attendees are invited to visit StratEdge at CSMantech, Space Tech Expo USA, and IMS to discuss application-specific packaging needs, die attach requirements, molded ceramic package options, and high-reliability assembly capabilities.

For more information, contact StratEdge at info@stratedge.com or visit www.stratedge.com.

Photo: www.stratedge.com/on-the-road.png

About StratEdge

StratEdge Corporation designs, manufactures, and provides assembly services for a complete line of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. The StratEdge portfolio includes post-fired ceramic and lower-cost molded ceramic packages and die-on-tab (sub-mount) assembly services engineered for GaN, GaAs, and SiC devices in telecom/5G, VSAT, broadband wireless, satellite, defense, test and measurement, automotive, clean energy, and harsh environments. Our facility in Poway, California, near San Diego, is both ITAR registered and ISO 9001:2015 certified.

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Engineers working with GaN, GaAs, and other compound semiconductor devices need packaging solutions that support high power, high frequency, thermal management, and long-term reliability. ~Tim Going, President of StratEdge